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    DDR3

    内嵌自检测修复（ECC）DRAM芯片系列产品是西安公海彩船推出的商用内嵌ECC技术DRAM芯片产品，具有高可靠、大容量、高位宽、高宽温、多接口等特点，与传统JEDEC标准DRAM芯片“即插即用”式兼容 。 针对质量有更高要求的用户，西安公海彩船提供超稳健性XR ECC DRAM芯片系列产品。

    Part No. Den. Org. Voltage Package Dim.(mm) Status Speed Temperature Model
    SCE15H1G800AF

    1Gb

    128Mbx8

    1.5V

    TFBGA78

    8x10.5

    MP

    1600/1333/1066

    I A3 A2 A1

    IBIS

    SCE15H1G160AF

    1Gb

    64Mbx16

    1.5V

    TFBGA96

    9x13

    MP

    1600/1333/1066

    I A3 A2 A1

    IBIS

    Notes

    • Temperature Specification

      C = Commercial Grade (0℃~95℃)

      I = Industrial Grade (-40℃~95℃), LPDDR4(x) -40℃~85℃

      A1 = Auto Grade 1 -40℃~125℃ (AEC-Q100,TS16949 Complied)

      A2 = Auto Grade 2 -40℃~105℃ (AEC-Q100,TS16949 Complied)

      A3 = Auto Grade 3 -40℃~95℃ (AEC-Q100,TS16949 Complied), LPDDR4(x) -40℃~85℃

    • MP

      Mass Production

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