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    DDR3

    第三代DDR SDRAM(第三代双倍数据速率同步动态随机存取存储器)广泛使用于电子设备中。如电视、机顶盒、OTT、平板、POE、BD播放器等。它通过较高的时钟频率达到比之前DDR2 SDRAM更高的数据带宽。

    Part No. Den. Org. Voltage Package Dim.(mm) Status Speed Temperature Model
    SCB13H8G162EF

    8Gb

    512Mbx16

    1.35V

    FBGA96

    7.5x13

    Sample

    1866

    I

    SCB13H8G162BF

    8Gb

    512Mbx16

    1.5V/1.35V

    TFBGA96

    9x13.5

    MP

    1600

    C I

    IBIS

    SCB13H8G162DF

    8Gb

    512Mbx16

    1.35V

    FBGA96

    9x13.5

    MP

    1600/1866

    C I

    SCB13H8G802BF

    8Gb

    1Gbx8

    1.5V/1.35V

    TFBGA78

    9x10.5

    MP

    1600

    C I

    IBIS

    SCB13H4G160AF

    4Gb

    256Mbx16

    1.5V/1.35V

    TFBGA96

    7.5x13.5

    MP

    2133/1866/1600

    C I

    IBIS

    SCB13H4G160BF

    4Gb

    256Mbx16

    1.35V

    FBGA96

    7.5x13

    Sample

    2133/1866

    C I

    SCB13H4G800AF

    4Gb

    512Mbx8

    1.5V/1.35V

    TFBGA78

    7.5x10.6

    MP

    1866/1600/1333

    C I

    IBIS

    SCB13H2G800EF

    2Gb

    256Mbx8

    1.35V

    TFBGA78

    7.5x10.6

    MP

    2133

    C I

    IBIS

    SCB13H2G160EF

    2Gb

    128Mbx16

    1.35V

    TFBGA96

    7.5x13.5

    MP

    2133

    C I

    IBIS

    SCB13H2G160FF

    2Gb

    128Mbx16

    1.35V

    FBGA96

    7.5x13

    MP

    2133/1866

    C I

    SCB13H2G800DF

    2Gb

    256Mbx8

    1.35V

    TFBGA78

    7.5x10.6

    MP

    1866/1600

    C

    IBIS

    SCB13H2G800AF

    2Gb

    256Mbx8

    1.35V

    TFBGA78

    8x10.5

    MP

    1600/1333

    I A3 A2

    IBIS

    SCB15H2G800AF

    2Gb

    256Mbx8

    1.5V/1.35V

    TFBGA78

    8x10.5

    MP

    1600/1333

    I A3 A2

    IBIS

    SCB13H2G160AF

    2Gb

    128Mbx16

    1.35V

    TFBGA96

    9x13

    MP

    1600/1333

    I A3 A2

    IBIS

    SCB15H2G160AF

    2Gb

    128Mbx16

    1.5V/1.35V

    TFBGA96

    9x13

    MP

    1600/1333

    I A3 A2

    IBIS

    SCB13H1G800EF

    1Gb

    128Mbx8

    1.35V

    FBGA78

    7.5x10.6

    Sample

    2133/1866

    C I

    SCB13H1G160EF

    1Gb

    64Mbx16

    1.35V

    FBGA96

    7.5x13

    MP

    2133/1866

    C I

    IBIS

    SCB15H1G800CF

    1Gb

    128Mbx8

    1.5V

    TFBGA78

    8x10.5

    MP

    1866/1600/1333

    C

    IBIS

    SCB15H1G160CF

    1Gb

    64Mbx16

    1.5V

    TFBGA96

    9x13

    MP

    1866/1600/1333

    C

    IBIS

    SCB13H1G160DF

    1Gb

    64Mbx16

    1.5V/1.35V

    TFBGA96

    7.5x13

    MP

    1866/1600

    C

    IBIS

    SCB15H1G800AF

    1Gb

    128Mbx8

    1.5V

    TFBGA78

    8x10.5

    MP

    1600/1333/1066

    I A3 A2 A1

    IBIS

    SCB15H1G160AF

    1Gb

    64Mbx16

    1.5V

    TFBGA96

    9x13

    MP

    1600/1333/1066

    I A3 A2 A2

    IBIS

    Notes

    • Temperature Specification:

      C = Commercial Temperature chip (DDR2, DDR3, DDR4: 0°C ~ +95°C; LPDDR2: 0°C ~ +85°C;SDR, DDR: 0°C ~ +70°C)

      I = Industrial Temperature chip (DDR2, DDR3: -40°C ~ +95°C; SDR, DDR, LPDDR2, LPDDR4: -40°C ~ +85°C)

      A1 = Automotive grade 1(-40°C ~ +125°C)

      A2 = Automotive grade 2(-40°C ~ +105°C)

      A25 = Automotive grade 2(-40°C ~ +115°C)

      A3 = Automotive grade 3(-40°C ~ +95°C);LPDDR4(-40°C ~ +85°C)

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