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    MCP

    MCP(多芯片封装存储器),广泛应用于通信模块、IoT等领域。

    Part No. Den. Org. Voltage Package Dim.(mm) Status Speed Temperature Model
    SCP30N2G1GSL-

    2Gb+1Gb

    256Mbx8 (NAND)+32Mbx32 (LPD2)

    1.8V

    FBGA162

    10.5x8

    MP

    1066/800

    E I

    IBIS

    SCP30N1G12SX-

    1Gb+512Mb

    128Mbx8 (NAND)+16Mbx32 (LPD2)

    1.8V

    FBGA162

    10.5x8

    MP

    1066/800

    E I

    IBIS

    SCP30N1G1GSL-

    1Gb+1Gb

    128Mbx8 (NAND)+32Mbx32 (LPD2)

    1.8V

    FBGA162

    10.5x8

    MP

    1066/800

    E I

    IBIS

    Notes

    • Temperature Specification:

      MCP: E = Extended grade(-25 °C to +85 °C); I = Industrial grade(-40 °C to +85 °C)

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